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Cryogenic material property information

Helium

Cryogenic properties of helium 4:

Cryogenic properties of helium 3:

Thermal contraction at cryogenic temperatures

The graph below shows the thermal contraction between room temperature and 4 K for some materials commonly used in cryostats:

Thermal contraction of various materials used in cryogenics (per 10^4):
PTFE (Teflon), 211; Nylon, 138; Stycast 1266, 115; Perspex, 112; Lead, 70; Vespel SP22, 63; Stycast 2850 FT, 51; Soft solder (50/50), 51; Aluminium, 51; Silver, 41; Brass (70/30), 37; Copper, 32; Gold, 32; Beryllium copper (Berylco 25), 32; Stainless steel 316, 30; Stainless steel 410, 17.6; Titanium alloy (Ti-6AL-4-V), 17.3; Tungsten, 8.6; Pyrex, 5.7; Invar, 5.2; Silica glass, 0.24

Links to sites with more information can be found here.

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Page created: Adam Woodcraft
Last edited 2009-8-17     Site map